Equipment flow:

Etching overflow water washing (1) (2) - clean water washing - Inspection (1) - film stripping - sewage flushing - overflow water washing (3) (4) - acid pickling - overflow water washing (5) (6) (7) - clean water washing - dry board combination - board discharging

Equipment specification:
External dimension of the equipment: 13848mm (L) * 2500mm (W) * 2500 ± 25mm (H) (the production rate is roughly proportional to the length of the equipment)
PCB board specification: I) 610 mm * 610 mm []
II) 200 mm * 200 mm [small]
III) 0.05-3.2 mm (excluding copper) [thickness] [standard: 35 wheelbase]
Production speed: 0.6-8 M / min (adjustable) [preset working yield: 2.5 m / min]
Equipment features:
1. Etch the anti pool effect design of horizontal swing nozzle with independent pressure regulation, spray more evenly and produce more smoothly;
2. The etching is equipped with mechanical (or vacuum) foam breaking device to avoid defoamer pollution and effectively reduce liquid waste;
3. The width of etch line is 2mil / 2mil, the etching uniformity c.o.v ≥ 96%, etching factor ≥ 5;
4. The results show that the cross inclined spray can wash the film more effectively;
5. The conical drum type membrane slag separation system can efficiently and cleanly collect and treat the membrane slag;